Intern in the EEE Components Section

Our team and mission

This position is based at the European Space Research and Technology Centre (ESTEC) - Noordwijk, Netherlands

Under the direct authority of the Head of the Electrical Department, the Avionics & EEE Division is responsible for all aspects related to Avionics (with inputs from AOCS/GNC), Data Systems, Microelectronics, Flight Software and EEE Components and associated laboratory facilities. The responsibilities also extend to technology/product development and support to standardisation. More specifically TEC-ED responsibilities encompass:

• Definition of Avionics architecture (with inputs from AOCS/GNC) including procurement of associated products and supported through the Division’s following responsibilities:
  • On-board computer and Data Handling (PL/PF) for space systems, including their procurement and end-to-end validation (in close collaboration with TEC-EF);
  • Engineering of on-board software in all phases including pre-development and independent verification & validation of critical software, supporting software-system and functional engineering activities.

• Microelectronics and EEE Components
  • Microelectronic devices and systems including development of radiation hardening techniques for such systems;
  • EEE Components both passive and active, including product development. Qualification, reliability and Radiation Hardness Assurance in support of TEC-Q;
  • Contribute to the European Space Component Coordination (ESCC) and all associated activities.

• Development and operation of a reference laboratory for components evaluation against the space environment (including radiation), reliability assessment, Data Systems, Microelectronics and Flight Software domains.

Candidates interested are encouraged to visit the ESA website: http://www.esa.int

Field(s) of activity for the internship

Topic of the internship: Study of methodologies for thermal resistance and junction temperature measurement on electronic devices

Reliability testing on electronic devices requires to know with extreme accuracy the applied junction temperature and consequently the existing thermal resistance (both at die and package level) on components which would be suitable as candidates for space applications. To achieve these parameters, several methodologies are applicable (extrapolation through electrical characterization, infrared thermography analysis, Raman spectrometry etcetera). The scope of the internship is to allow a comparison of these techniques on devices that will be submitted to a preliminary selection and preparation. After a preliminary bibliographic study of techniques and existing methodologies, the selected candidate will be introduced and accompanied in the ESTEC laboratory which disposes of relevant equipment and tools allowing the performing of such analyses and measurements. A test method program will be defined for the preparation and conditioning of the specimens in conjunction with the conduction of the analyses and the characterizations. A final report will include a detailed description of the applied protocols and of the achieved results leading to a final statement as well for the suitability of each technique with respect to the selected components/packages. 

Behavioural competencies

Result Orientation
Operational Efficiency
Fostering Cooperation
Relationship Management
Continuous Improvement
Forward Thinking

For more information, please refer to ESA Core Behavioural Competencies guidebook

Education

You must be a university student, preferably in your final or second-to-last year of a university course at Master’s level and you need to remain enrolled at your University for the entire duration of the internship.

Additional requirements

The working languages of the Agency are English and French. A good knowledge of one of these is required. Knowledge of another Member State language would be an asset.

Knowledge and background in semiconductor physics and bench testing implementation are a valuable asset.