United States-Maryland-Baltimore, United States
$93-173k
Full Time
3 minutes ago
Job description
Description
At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.Northrop Grumman Mission Systems is seeking a Principal / Senior Principal Mechanical Electronic Packaging Engineer to join our team of qualified, diverse individuals. This position will be located in Linthicum, Maryland.
Overview:
You will work as part of a cross-functional team that is responsible for the design and development of cutting-edge AESA antenna hardware that is featured in Northrop Grumman's world-class radar, ESM and communications systems, that are fielded on a multitude of airborne, marine, ground-based, and space military platforms. You'll support multiple projects spanning the product lifecycle, from R&D to full-rate production. Some example AESA products can be viewed at this website: https://www.northropgrumman.com/what-we-do/air/active-electronically-scanned-array-aesa-radars/ As an integral part of the Engineering and Sciences team, you will be responsible for the design and development of cutting-edge AESA antenna hardware that is featured in Northrop Grumman's world-class radar, ESM and communications systems.
Roles and Responsibilities include:
- Design, prototyping and production support of state-of-the-art RF, digital, and mixed signal multi-chip modules (MCMs), Printed Wiring Boards (PWBs), and Circuit Card Assemblies (CCAs) using various substrate materials and chip-scale packaging technologies
- Collaboration within a cross-functional Integrated Product Team (IPT); effective and timely communication with peers in adjacent functions, including electrical design, systems engineering, thermal analysis, structural analysis, drafting, supply chain management and manufacturing.
- Organizing and prioritizing tasks in order to accomplish project milestones within schedule and budgetary constraints.
- Providing technical leadership and mentoring to less experienced personnel.
This position may be filled as a Principal Mechanical Electronic Packaging Engineer or a Senior Principal Mechanical Electronic Packaging Engineer.
This position is contingent on the ability to obtain/maintain a US Secret Clearance or higher and contract award
Basic Qualifications for Principal Mechanical Electronic Packaging Engineer:
- Bachelor’s degree with 5 years of experience, a Master’s degree with 3 years of experience or a PhD with 0 years of experience in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields. Will consider 4 years of applied experience in lieu of degree requirement
- U.S Citizenship with the ability to obtain/maintain an active DoD Secret Clearance
- Experience with microelectronic packaging design, including chip-scale packaging technologies and substrate\PWB layout
- Working knowledge of materials, specifications, manufacturing processes and design tools utilized for multi-chip modules, PWBs and CCAs
- Proficient with AutoCAD
- Familiarity with NX or other 3D modeling software
Basic Qualifications for Senior Principal Mechanical Electronic Packaging Engineer:
- Bachelor’s degree with 8 years of experience, a Master’s degree with 6 years of experience or a PhD with 3 years of experience in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields. Will consider 4 years of applied experience in lieu of degree requirement.
- U.S Citizenship with the ability to obtain/maintain an active DoD Secret Clearance
- Experience with microelectronic packaging design, including chip-scale packaging technologies and substrate\PWB layout
- Working knowledge of materials, specifications, manufacturing processes and design tools utilized for multi-chip modules, PWBs and CCAs
- Proficient with AutoCAD
- Familiarity with NX or other 3D modeling software
Preferred Qualifications:
- Advanced degrees in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields.
- Active DoD Secret Clearance or higher
- Proficiency with ASME Y14.5 geometric dimensioning and tolerancing (GD&T) and ASME Y14.100 engineering drawing practices
- Familiarity with thermal and structural analysis considerations, methodologies, and software tools
- Experience with hands-on assembly and testing of prototype electronic hardware
- Experience in a technical leadership role on a cross-functional product development team
This positions standard work schedule is a 9/80. The 9/80 schedule allows employees who work a nine-hour day Monday through Thursday to take every other Friday off.
As a full-time employee of Northrop Grumman Mission Systems, you are eligible for our robust benefits package including:
- Medical, Dental & Vision coverage
- 401k
- Educational Assistance
- Life Insurance
- Employee Assistance Programs & Work/Life Solutions
- Paid Time Off
- Health & Wellness Resources
- Employee Discounts
Link to Benefits: https://totalrewards.northropgrumman.com/
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