San Fransisco, California, United States
$60-60k
Internship
2 months ago
Job description
Astranis is on a mission to bridge the digital divide by connecting the four billion people worldwide who currently lack internet access. We're doing this by building the next generation of smaller, more cost-effective spacecraft to bring the world online.
As a team, we’ve launched two satellites into orbit, signed ten commercial deals worth over $1 billion in revenue, raised over $500 million from top global investors, and recruited a team of over 300 world-class engineers. We all work out of our (legendary) San Francisco office, which was once used to build ships during the World Wars.
Our satellites, which operate from geostationary orbit (GEO), weigh only 400 kg and utilize a proprietary software-defined radio payload. Each satellite can connect over two million people, and we’re very excited for the impact we’ll soon have in the Philippines, Peru, Mexico, and more!
Backed by substantial funding and a passionate, collaborative team, we offer a rewarding work environment where you'll learn and make a significant impact, no matter where you are in your career.
Apply and join us on our journey towards global connectivity!
Thermal — Intern (Spring 2025)
As an Intern, you will have an amazing opportunity to work on hard problems — we pride ourselves on giving everyone at Astranis a chance to do meaningful work on complex projects, no matter their seniority. Many past interns have designed and tested hardware/software that is heading to space on our first satellite, and many of them are now full-time employees at Astranis.
Role
- Work together with the engineering team to design, evaluate, build, and test satellite hardware and/or software.
- Support design trades that successfully balance performance margins, resource use, risk, cost, and schedule.
- Perform thermal analysis to varying degrees of fidelity (simplified to detailed) on a variety of different types of hardware such as propulsion components, batteries, high powered electronics, RF components, mechanisms, and printed circuit boards (PCBs).
- Design, evaluate, procure and test thermal solutions such as heaters, heat pipes, thermal interface materials, and surface coatings.
- Develop processes and procedures for integration and assembly which ensure thermal design intent is met. Collaborate with the integration and test team in the installation of thermal hardware as needed.
- Plan and run thermal vacuum testing and verification at the component and spacecraft level.
Requirements
- Currently pursuing a B.S. or M.S. in mechanical, aerospace, or equivalent technical degree (e.g. physics or applied math)
- A passion and enthusiasm for hardware development, including working in a fast-paced environment and hands-on design and development
- Demonstrated ability to personally design, build, and test hardware from scratch.
- US Citizenship or Green Card
- Don't meet them all? Not a problem. Please apply even if you do not meet all these criteria.
Bonus
- Experience with CAD
- Experience with analytical software thermal analysis such as ANSYS and Thermal Desktop
- Experience with electronics systems design and packaging
- Experience (projects or previous internships) related to aerospace
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