United States-Maryland-Linthicum, United States
$69-125k
Full Time
2 months ago
Job description
Description
At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.Northrop Grumman Microelectronics Center (NGMC) within Northrop Grumman Mission Systems is seeking an exceptionally talented, motivated, and creative Photolithography Engineer for our Advanced Technology Lab (ATL) - located outside of Baltimore, Maryland - where we design, manufacture, and test semiconductor products for internal and commercial production customers as well as emerging technology programs.
Northrop Grumman’s ATL semiconductor foundry provides unique capability supporting a range of production microelectronic devices (Silicon, Gallium Arsenide, Gallium Nitride, Silicon Carbide) and providing leading edge technology development in superconducting electronics. Our devices enable multiple generations of Northrop Grumman’s ground-based radars, avionic radars, and space systems.
Join us for the chance to work with an amazing, experienced, and talented team while helping serve your country. Enjoy the opportunity to grow and learn through a variety of challenging projects in R&D, ongoing long-term programs, and new programs targeting future military platforms.
Our multidisciplinary foundry team enables activities spanning from development to sustainment process engineering. ATL is responsible for all aspects of semiconductor technology including design, mask making, wafer fabrication, test, and assembly. Candidates must be strong team participants, have excellent communication skills, and be resourceful as well as multi-disciplinary. A strong understanding of semiconductor technology, direct process development experience and production background is essential.
The Photolithography Engineer should possess some knowledge of lithography principles and practices. Should possess some entry level experience of I-line patterning systems, contact lithography, resist spin-coating operations, and adhesive wafer-bonding. This engineer should also be familiar with a wide variety of metrology tools including CDSEM and Overlay measurement. The selected candidate should be hands on and demonstrate an ability to communicate well with others.
The Photolithography Engineer will be responsible for:
Process qualifications, technician training and certification, and process safety. Support superconducting line including assisting with processing material. Interfacing with other unit process engineers and product integration engineers to develop processes to support new products. Writing and maintaining process documentation. Supporting statistical process control (SPC) and continuous improvement efforts.
#NGATL
This requisition may be filled as an Associate Photolithography Engineer or Photolithography Engineer
Basic Qualifications for Associate Photolithography Engineer:
• Bachelors degree in a related technical discipline with 1 year of relevant experience
• Hands-on knowledge and operation of lithography steppers, direct-write patterning, tracks, CDSEM, and overlay tools.
• Experience with semiconductor fabrication
• US Citizenship required
• Must be able to obtain and maintain a Secret clearance
Basic Qualifications for Photolithography Engineer:
• Bachelors degree in a related technical discipline with 2 years of relevant experience, 0 years with a Masters degree.
• Hands-on knowledge and operation of lithography steppers, adhesive wafer-bonding, resist coat tracks, CDSEM, and overlay tools.
• Experience with semiconductor fabrication
• US Citizenship required
• Must be able to obtain and maintain a Secret clearance
Preferred Qualifications:
• Experience working in a compound and Si semiconductor fab as a photolithography engineer.
• Strong understanding of semiconductor technology and photolithography principles.
• Experience with adhesive wafer-bonding and thermal dismount of bonded wafers.
• Experience with coat / develop tracks including C&D P8000, SVG 86xx/88xx, SVG 90S, TEL Mark V, and TEL ACT8 tracks.
• Knowledge of resist chemistry and general resist processing, adhesive chemistry.
• Data analysis and visualization (JMP and/or MiniTab).
• Advanced knowledge of statistical process control (SPC).
• Experience in structured problem-solving methodology to troubleshoot tool and process issues.
• Ability to work with minimal supervision.
• Excellent project management skills with demonstrated ability to identify manufacturing improvements, manage change, and implement solutions.
• Ability and desire to assume a technical leadership role within the organization.
#NGMCFab
Salary Range: $68,800.00 - $103,200.00Salary Range 2: $83,300.00 - $124,900.00The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions.Employees may be eligible for a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates.Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit http://www.northropgrumman.com/EEO. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.
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